Second Project review – Clermont-Ferrand July, 4th 2019
The WinSiC4AP project second year revision took place the July 4th 2019 at Punch PowerTrain venue in Clermont-Ferrand.Read More
Technical Meeting – Clermont-Ferrand July, 3th 2019
The WInSiC4AP project technical meeting took place the July 3th 2019 at Punch PowerTrain Clermont-Ferrand venue
The partners met and, guided by the project Coordinator and scientific Responsable, presented their project updates.
Annual Technical Meeting – Tours March, 6th 2019
“Silicon carbide powering sustainable mobility” published the article about the “WInSiC4AP” project in the Platinum magazine
The WInSiC4AP project is one of the fi rst examples of the technical and scientific integration of two financial mechanisms, one is European (funds from the ECSEL JU programme) and the other all-Italian FESR funds from the Italian Ministry of Education and Universities: this characteristic explains how the project can count on such important funding – to cover part of the about 30 million euro of the research costs – , and the many projects partners involved – (twenty in total covering four different Countries, and coordinated by the Sicilian Micro and Nano Systems Technological District).
read the full article: Open link
First Project review – Brussels July, 18 2018
Ecsel Italy 2018
The second edition of the ECSEL Mirror Group Italia National Day, held on 1 March 2018, was confirmed as the reference forum for the Italian participation in the calls for the joint ECSEL technology initiative and other H2020 funding programs.
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4th National Sensors Convention
The Technology District sponsored the 4th National Sensors Convention, organized every two years by major scientific societies in Italy and hosted, for this edition, in Catania from 21 to 23 February 2018 in the prestigious headquarters of the Diocesan Museum.Read More
EFECS 2017
EFECS (European Forum for Electronic Components and Systems) is the international forum with a focus on ‘Our Digital Future’ along the Electronic Components and Systems value chain in Europe. The organisers of this event, AENEAS, ARTEMIS-IA, EPoSS, ECSELRead More
Interconnections & Packaging Forum
In the frame of Aerospace Valley Cluster, the DAS (Stategic Activities Domain) ESE (Electronics & Embedded Equipment’s) was organized a forum on “New Power Electronics Components: Interconnections & Packaging – Innovations et Challenges”.Read More
DECIELEC 2017 Forum
DECIELEC Forum : Labege (France), October 18-19, 2017. Reference event for electronics, connected & embedded systems.
Participants benefited from the Business Convention unique concept:
– Business meetings dedicated to electronics, Read More
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