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AIDAA International Conference

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DTSMNS represented the project as a whole (and Leoluca Liggio took a plenary speech section) at the AIDAA International Conference, in September 2017, in Palermo.
It were present also Filippo D’Arpa and prof. Costantino GiaconiaRead More


ICSCRM 2017

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The International Conference on Silicon Carbide and Related Materials is the most important technical conference series in the world for electronics devices technology based on silicon carbide (SiC) and related materials.
The ICSCRM2017 was held September 17–22, 2017,Read More


CNR-IMM Web article

CNR-IMM (National Research Council of Italy – Institute for Microelectronics and Microsystems) has published on his website the article: “A New European Project on Silicon Carbide – WInSiC4AP – started in June 2017”

Click here to read


Project Kick-off Meeting

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The WInSiC4AP project was kicked off in June 27, 2017 with the full consortium members presence. The day was focused on the project scope, work package presentations by the work package leaders, and the aim was to confirm the planning the actions.Read More


ECSEL ITALY

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The first edition of the ECSEL Mirror Group Italia National Day, held on 23 June 2017, was confirmed as the reference forum for the Italian participation in the calls for the joint ECSEL technology initiative and other H2020 funding programs.Read More


ECSEL SYMPOSIUM 2017

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The ECSEL symposium in Malta was held on June 2017 under the auspices of the Maltese Presidency of the Council of the EU. Industry, research, finance and the academic world participated together with policy makers at European, national and regional levels.Read More


This project has received funding from the Electronic Component Systems for European Leadership Joint Undertaking (ECSEL JU) under grant agreement No.737483. This Joint Undertaking receives support from the European Union’s Horizon 2020 research and innovation programme and Czech Republic, France, Germany, Italy.

This project also receives ESI funds from MIUR 2014-2020 FESR program.